Description
Polyimide (PI)
Polyimide is a non melting high temperature polymer. Strength, dimensional stability, and creep resistance remain high even at temperatures above 260°C. Low wear rates combined with the ability to work under unlubricated conditions and high pV-rates makes it the ideal material for challenging friction and wear applications, extending lifetime and reducing maintenance costs. Its high purity and low outgassing are needed for applications in the vacuum, space and semiconductor industry.
Properties
- High strength, modulus and stiffness also at high temperatures over 260 °C
- Excellent dimensional stability to 350°C continuous use. (short term up to 400°C)
- Superior wear and creep resistance
- Exceptional performance under load and at high temperatures
- Low thermal and electrical conductivity
- Low coefficient of friction
- Good maichnability
Applications
- Semiconductor Industry: semiconductor manufacturing process equipment with high purity, high resistance. Such as wafer clamping rings, wafer carries, wafer guides, wafer tips, test sockets, die-pickup collets, vacuum pads, bearings, centering pins, alignment pins, insulators, screws & fasteners
- Automotive industry: thrust washer or piston rings in transmission and pumps replacing traditional metals
- Aero space industry: Jet engine parts such as pads, bumpers, seals and bearings
- Industrial machinery: nozzle tip insulators for hot runner nozzles used for injection molding of thermoplastic products such as PET preforms, PET caps
POLYIMIDE (PI) TECHNICAL DATA SHEET | ||||
Properties | Temperature | Test Method | Unit | Typical Value |
Physical Properties
Color | – | – | – | Brown |
Density | – | GB1033 | g/cm³ | 1.38-1.42 |
Mechanical Properties
Tensile Strength | 23℃ | GB/T1040-2006 | Mpa | 96.3 |
260℃ | 49.4 | |||
Elongation at Break | 23℃ | GB/T1040-2006 | % | 6.3 |
260℃ | – | |||
Tensile Modulus | 23℃ | GB/T1040-2006 | Mpa | 3140 |
260℃ | – | |||
Flexural Strength | 23℃ | GB/T1040-2000 | Mpa | 154 |
260℃ | 85.6 | |||
Flexural Modulus | 23℃ | GB/T1040-2000 | Mpa | 2990 |
260℃ | 1640 | |||
Compress Strength | 23℃ | GB/T1040-2000 | Mpa | 138.6 |
260℃ | 83.8 | |||
Compress Modulus | 23℃ | GB/T1040-2000 | Mpa | 1620 |
260℃ | 1410 | |||
lzod Unotched Impact Strength | 23℃ | GB/T16420-1996 | Kj/m2 | 83.2 |
260℃ | – |
Thermal Properties
Glass Transition Temperature | DMA | ℃ | 396 |
5% Weight Loss Temperature | TGA | ℃ | 579 |
The Lowest Working Temperature | – | ℃ | -248 |
Heat Deflection Temperature | GB/T 1634.2 | ℃ | 430 |
Electrical Properties
Surface Resistvity | GB1410 | Ω | 1014 |
Volume Resistvity | GB1410 | Ω.cm | 1015 |
Dielectric Strength | – | KV/mm | 22 |
Dielectric Constant | – | – | 3.6 |
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